Firstly, a brief introduction was given to commonly used two-dimensional materials, including graphene, transition metal dichalcogenides (TMDC), black phosphorus (BP), and hexagonal boron nitride ...
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024
Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...
Seoul National University’s College of Engineering announced that a research team led by Professor Chul-Ho Lee from the Department of Electrical and Computer Engineering has outlined a comprehensive ...
Researchers from Ulsan National Institute of Science and Technology (UNIST), Yonsei University, Sungkyunkwan University, University of Chemistry and Technology Prague, and Sogang University developed ...
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