Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

If you are familiar with Moore’s Law, you’ve probably read pronouncements that the premise of transistor counts doubling each year is reaching a wall due to complex process technologies and device ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...