Advanced interconnect materials and technologies represent a pivotal aspect of modern integrated circuits, addressing both the miniaturisation of device architectures and the increasing performance ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

DuPont de Nemours, Inc. DD will demonstrate its cutting-edge developments in circuit materials at Intelligent Asia Thailand ...

Keysight Technologies, Inc. (NYSE: KEYS) and Point2 Technology today announced a strategic collaboration to validate next-generation, multi-terabit interconnects designed to eliminate scale-up ...

U.S. semiconductor companies were among the first to respond by disaggregating large chips into smaller, specialized chiplets ...

The landscape of modern computing infrastructure continues to evolve at an unprecedented pace, driven by emerging standards that bridge traditional boundaries between processing, memory, and storage ...

TOKYO, June 3, 2025 /PRNewswire/ -- DuPont (NYSE:DD) today announced its participation in the Total Solution Exhibition for Electronic Equipment 2025 (JPCA Show 2025), taking place from June 4-6 at ...

Insight into the SnapMagic and Harwin partnership. Information on new CAD models and PCB schematics. Available design formats. “Harwin aims to support engineers with best-in-class tools and services ...

Embedded Multi-die Interconnect Bridge-T (EMIB-T) was a prominent highlight of the Intel Foundry Direct Connect event. Intel is promoting this advanced packaging technology as a key building block for ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...