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This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
Morning Overview on MSN
MIT’s chip stacking leap could slash energy use for hungry AI chips
Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...
Check out Electronic Design's coverage of DesignCon 2024. The semiconductor industry is entering the age of the chiplet. Today, many of the world’s most advanced chips consist of several smaller ...
Researchers used 3D printing and capillary action to create customizable neural chips, expanding design freedom for brain research, biosensors and biocomputing. (Nanowerk News) Cultured neural tissues ...
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
A new chip-based quantum memory uses 3D-printed “light cages” to store light in atomic vapor with high precision. Quantum ...
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