Alpha and Omega Semiconductor Limited released a family of low on-resistance 8V, 20V, and 30V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of ...

The industry's first chip-scale packaging technology designed for highly integrated RF modules, the Pyxis platform promises reductions in cost, height, and area of 50%, 60%, and 75%, respectively, ...

Maxim Integrated Products introduces the MAX16072-MAX16074 microprocessor supervisory circuits in a 1mm x 1mm chip-scale package Maxim Integrated Products introduces the MAX16072-MAX16074 ...

Achieving the circuit densities we need for the next generation of electronics demands advanced packaging and chip-scale interconnect solutions. The need to look for alternative packaging solutions to ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Lumotive, a Washington based company backed by Bill Gates, recently announced an impressive $45M Series B raise (at a ~$200M valuation) to continue its journey in revolutionizing Light Control ...

BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip ...

On the morning of January 28th, FPT announced the establishment of a semiconductor chip testing and packaging factory in ...

Cold atom experiments are among the most powerful and precise ways of investigating and measuring the universe and exploring the quantum world. By trapping atoms and exploiting their quantum ...

Professor Daniel Blumenthal's lab develops chip-scale components that can bring the power and precision of quantum science outside of the tightly controlled environment of the lab. (Santa Barbara, ...