Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...

How model-based systems engineering (MBSE) has improved system design. Thermal design and MBE come together. When considering systems-level design, it’s important to understand the criticality of the ...

The U.S. Army’s Communications-Electronics Research, Development and Engineering Center has created a system to streamline testing, rid unneeded and redundant analysis and even eliminate duplicative ...

Prior knowledge needed: ECEA 5700 Introduction to Power Electronics, ECEA 5701 Converter Circuits, ECEA 5702 Converter Control, ECEA 5703 Magnetics Design ...

Several aspects must be taken into account when dealing with power electronic design. Within a system we can identify different elements such as thermal dissipation, electrical characteristics, ...