Kemtronics is showing strong performance. Securities firms' analysis that the TGV process business, a core process of glass substrates based on large-area display glass wafer etching technology, will ...

This company has developed a negative photo-definable polyimide sheet for glass-core substrates in used to connect chips to ...

TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more Intel said it has made a significant ...

Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...

Sumitomo Chemical Chairman Keiichi Iwata (left) and Samsung Electro-Mechanics President Duckhyun Chang sign an MOU. The joint venture MOU is part of a strategy to overcome the limitations of package ...

Why it matters: AMD may not manufacture its own chips anymore, but that hasn't stopped it from investing in research and custom process technologies for its chips. Now, the company has its sights on ...

Samsung Electro-Mechanics is gaining an edge in the industry's race to commercialize glass core substrates, a next-generation semiconductor packaging material, by agreeing to establish a joint venture ...