Despite strong gains this year, Samsung Electronics and SK Hynix shares are even less expensive than their U.S. counterparts.

The global High Bandwidth Memory (HBM) market is experiencing explosive growth driven by AI demand. The industry is heavily investing in 3D-stacked memory architecture (TSV technology) and advanced ...

Samsung ships HBM4 memory at 11.7Gbps speeds and claims an early industry lead ...

Micron has been one of the biggest winners in the AI boom.

Memory, especially High Bandwidth Memory, plays an important role in ensuring AI workloads run efficiently and fast, reducing ...

MU, has begun high volume production and ahead of schedule shipments of its HBM4 memory chips. The company reports that all ...

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

At CES 2026, sleek new laptops dazzled—but soaring memory costs driven by AI chip demand threaten to make everyday PCs ...

Samsung Electronics announced Thursday it had started mass production of next-generation memory chips to power artificial intelligence, touting an "industry-leading" breakthrough.

Professor Kim Joung-ho of the Korea Advanced Institute of Science and Technology (KAIST), known for devising the basic ...

Western Digital is introducing a couple of new technologies, dubbed "High Bandwidth Drive" and "Dual Pivot", that will significantly boost the performance of hard drives. According to Western Digital, ...