Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...

Design of power/driver ICs in compliance with latchup qualification requirements involves a conceptually different approach in comparison with digital LV (low voltage) ICs. The LV ICs’ electrostatic ...