IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits. Everyone wants small size and ...

Facility layout and design is an important component of a business’s overall operations, both in terms of maximizing the effectiveness of the production process and meeting the needs of employees. The ...

The colors, patterns and textures in your product packaging affect a consumer’s purchase decision. The human brain reacts ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Consumers do make snap judgements based on what they’re looking at. They look at a product, and its packaging says something to them. Packaging is eye-catching and inviting, and it’s critical for ...

As HDAP designs become more popular, the need for post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification (DRC and LVS) is growing. Mentor provides ...