Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Smaller is better when it comes to sterile device package design. The EtO package design is generally either a Tyvek lidded thermoform tray, a Tyvek-poly film pouch, or, for moisture- and ...

According to Walmart’s corporate website, Wal-Mart Discount Stores offer 120,000 items and their Wal-Mart Super Centers offer approximately 142,000 different items in-store. That creates a very ...

Chips are getting bigger in a bid to offer more functionality, and conversely, packages are required to house these bigger die sizes in even more compact form factors. That inevitably mandates new ...

It’s become increasingly difficult to ignore the impact waste and carbon emissions are having on the climate, from changing weather patterns to rising sea levels. While many countries across the globe ...