CHANDLER, Ariz. — Amkor Technology Inc., a provider of contract assembly and test services, has expanded its ability to package image sensors and claims to have 13% of the CMOS image sensor packaging ...
TI pioneers new magnetic packaging technology for power modules, cutting power solution size in half
DALLAS, July 16, 2024 /PRNewswire/ -- Texas Instruments (TXN) today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage ...
Taiwan-based contact image sensor module maker Asia Tech Image has stepped into packaging 13-megapixel smartphone-use lens modules based on its COB (chip on board) process and will begin shipments to ...
MEMS and sensor devices have catapulted the Internet of Things (IoT) toward the deployment of billions of sensors in a myriad of applications in electronics technology that will improve the world ...
DUBLIN--(BUSINESS WIRE)--The "ZF S-Cam 4 - Forward Automotive Mono and Tri Camera for Advanced Driver Assistance Systems" report has been added to ResearchAndMarkets.com's offering. Based on a ...
The power module packaging materials market will reach almost $6.1 billion by 2030 with a CAGR of almost 11% between 2024 and 2030, says Yole Group. The power module packaging materials market will ...
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