Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

Not long ago, greater integration between the processing and packaging functions was seen partly as an emerging trend and partly as an interesting possibility—an intriguing “if” out there on the ...

In order to assist manufacturers in complying with the ISO 11607 standard requirements for packaging process development, equipment manufacturers are increasingly incorporating validation software and ...

Researchers are creating a new high speed environmentally-friendly packaging process that will use recycled materials and reduce the amount of plastic used, cutting the waste that goes into landfill.

Ultra-thin and energy efficient displays that use organic compounds to emit light have been stirring up excitement in the consumer electronics industry for several years. Researchers have now ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...