A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...

Santa Clara, CA and Kyoto, Japan, April 24, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...

CHANDLER, Ariz., Sept. 16, 2025 (GLOBE NEWSWIRE) -- The growing need for compact, efficient and reliable power solutions is driving demand for power management devices that provide higher power ...

As global energy demand surges—driven by AI-hungry data centers, advanced manufacturing, and electrified ...

DALLAS, July 16, 2024 /PRNewswire/ -- Texas Instruments (TXN) today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage ...

Challenges when dealing with high-power-density designs. Utilizing cloud manufacturing platforms (CMPs). Power packaging using additive manufacturing. Today’s designers are now more equipped to ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

As a key component in energy conversion system, power semiconductor devices are widely used in various applications, e.g., electric vehicles, renewable energy conversion, and uninterrupted power ...

Infineon Technologies AG has released the next generation of high-density power modules, supporting AI and high-performance data-center compute. Data centers represent two percent of global energy ...