The relentless pursuit of performance in sectors such as AI, cloud computing, and autonomous driving is creating a heat crisis. As the next generation of processors demand more power in smaller spaces ...
Amkor Technology Inc. and ASAT Holdings Ltd. have entered a comprehensive patent cross-license agreement for their respective quad-flat no-lead (QFN) semiconductor packages. Amkor, Chander, Ariz., and ...
BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...
Design engineers using 0.5-mm pitch 48-position MLF/QFN packaged ICs will be interested in the PA-MLF48A-P-Z-02 adapter, which provides high-performance quick prototyping. It comes with a clam-shell ...
TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...
UTAC Holdings, a Singapore-based semiconductor testing and assembly services provider, has introduced two new offerings to bolster its quad flat no-lead (QFN) portfolio - a 0.3mm thin QFN package and ...
Infineon Technologies has launched the IRPS5401, a five output Point of Load (POL) digital voltage regulator for FPGAs, ASICs, and other multi-rail power systems. The IRPS5401has been developed as a ...
Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. While much attention with regard to IC packaging is on 3D stacking and integration ...
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