The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...

CHICAGO, March 25, 2024 /PRNewswire/ -- The report "Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die ...

NEW YORK, Dec. 2, 2024 /PRNewswire/ -- Report on how AI is redefining market landscape - The global semiconductor advanced packaging market size is estimated to grow by USD 22.79 billion from ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Guadalajara plan expands ASE’s global footprint, increases presence in North America The future establishment of a semiconductor packaging and test facility in Jalisco paves the way for the ...

With Micron's ATMP facility moving into commercial production and fresh investments from domestic players, India's ...

Malaysian Prime Minister Anwar Ibrahim announced the National Semiconductor Strategy (NSS), with the government allocating MYR25 billion (US$5.3 billion) to foster industry development. According to ...