In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

A new technical paper titled “3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and Universidad Complutense de Madrid.

The simulation tracks a satellite's surface and internal temperature changes as it orbits Earth, considering varying thermal inputs from sunlight and Earth's shadow. Monte Carlo radiation modeling ...

Part one of this series, published in the January 2007 issue, discussed how to use linear superposition in the steady-state analysis of multiple heat-source systems. However, linear superposition also ...

The University of Chicago announced this week the formation of the first U.S.-based node of the Centre Européen de Calcul Atomique and Moléculaire (European Centre for Atomic and Molecular Computation ...