One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...

Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...