China Top 5G Wireless Conference Microphone Supplier: HUAIN’s Breakthrough for Smart Collaboration

ZHUHAI, GUANGDONG, CHINA, February 6, 2026 /EINPresswire.com/ -- The smartest meeting rooms in 2025 share a quiet ...

Top UHF Conference System Supplier From China: HUAIN’s Technology Behind Seamless Communication

ZHUHAI, GUANGDONG, CHINA, February 6, 2026 /EINPresswire.com/ -- In 2025, AV teams share a common challenge: who is the ...

China Leading AV Solution Provider HUAIN Powers Smarter Meetings With Dual-Diaphragm & Anti-Eavesdropping Tech

ZHUHAI, GUANGDONG, CHINA, February 6, 2026 /EINPresswire.com/ -- The most pressing question in modern collaboration is ...
IEEE

Improved Anand model considering the influence of sintering process on the packaging interconnection of power modules

Abstract: Firstly, this investigation designs five distinct sintering processes for sintered silver interconnect materials and prepares interconnect specimens separately. Then, the evolution of ...
News | University of Arkansas

$3.5 Million Award to Advance Power Device and Electronic Module R&D

The federal award enables the High Density Electronics Center to upgrade its equipment and capabilities while conferring status as a Power Packaging Center of Excellence.
IEEE

Bond-Wire Layout Optimization in Power Modules Through Simulation of Electro-Thermo-Mechanical Migration Flux Under Power Cycling

Abstract: The lifetime of power modules is affected by degradation of the emitter connection and die-attach material. Increasing requirements on power modules e.g., higher power density, requires ...