COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series. SAN DIEGO, CA, UNITED STATES, ...
Here are our picks for the top 10 edge AI chips with a bright future across applications from vision processing to handling multimodal LLMs.
Optional PCIe expansion enables scalable SD-Edge deploymentTaipei, Taiwan - January 28th, 2026 - Edge computing today ...
Congatec conga-TCRP1 is a COM Express 3.1 Type 6 Compact module powered by the newly announced AMD Ryzen AI Embedded P100 ...
Innodisk has recently introduced the EXEC-Q911, a COM-HPC Mini starter kit designed for edge AI applications powered by a ...
The global glass processing industry is undergoing a period of significant technological transition, driven by the ...
CES 2026 showcases the latest AI-powered devices and systems, from vision chips for automotive to sensing solutions for AI ...
Virtualization helps overcome the limitations of traditional test systems. By consolidating multiple PCs into a single ...
They accelerate embedded computing applications with up to 59 TOPS of combined AI inference performance, with up to 50 TOPS provided by the XDNA2 NPU, and the remaining performance delivered by up to ...
Geniatech debuts its i.MX95 SOM series, featuring OSM and SMARC modules with multi-core ARM computing, AI acceleration, and ...
Industrial AI deployment traditionally requires onsite ML specialists and custom models per location. Five strategies ...
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