Today, we are pleased to share Waystar Holding Corp.'s strong Q4 and full year 2025 results, reflecting the durability of our ...
Continued innovation in advanced packaging opens a clearer path to the outcomes the industry prioritizes. By tightening the physical distance between compute, memory, and interconnect, chipmakers ...
Abstract: This study presents a heterogeneous metasurface that facilitates the close integration of a high-permittivity ceramic back cover into a 5G dual-band millimeter-wave (mmWave) smartphone. The ...
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