PCBAIR's upgraded production line now supports precision heavy-copper fabrication of up to 10 oz (approx. 350µm) for both ...
TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...
More power in the same footprint is the constant request of the power industry’s customers. This challenge has hit a fever pitch as digital semiconductor packaging technology has increased performance ...
Semiconductor manufacturers have developed innovative production techniques that enable the integration of multiple components and a dc-dc converter IC die into a single module. Producing such a dc-dc ...
NUREMBERG, Germany--(BUSINESS WIRE)--Fibocom (Stock Code: 300638, SZSE), a leading provider of cellular embedded wireless module solutions for the Internet of Things (IoT), to unveil its LTE Cat.1 ...
Power modules might be the semiconductor industry’s answer to some constant problems. With advanced component integration, optimization, and performance, modules deliver a power solution that ...
Developing a power module requires enhanced design and verification methods. Currently, multiple iterations are needed to get the design done. Today, design and manufacturing processes are heavily ...
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