Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

In a few weeks, Intel will release Ivy Bridge, the first mass-produced 22nm parts, and more importantly the first to use 3D "tri-gate" FinFET transistors. These CPUs will be incredibly fast and use ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

Apple plans to use advanced 3D chip stacking technology in its upcoming MacBook series which is scheduled to be launched in 2025, which is said to be a breakthrough in chip packaging technology. The ...

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