Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling new Universal Flash Storage(1) (UFS) Ver. 4.1 embedded memory devices with 4-bit-per-cell, ...

TOKYO--(BUSINESS WIRE)--Kioxia Corporation, a world leader in memory solutions, today announced that it has begun sampling new Universal Flash Storage 1 (UFS) Ver. 4.1 embedded memory devices with ...

KIOXIA America, Inc. today announced that it has begun sampling 1 new Universal Flash Storage 2 (UFS) Ver. 4.1 embedded memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology.

TL;DR: KIOXIA has launched sampling of UFS 4.1 embedded memory devices featuring 8th-gen BiCS FLASH 3D QLC technology, delivering higher storage capacity and up to 25% faster sequential writes and 90% ...

In addition to the BG7 Series Client SSDs, Kioxia also brought its new 245.76TB LC9 Enterprise SSDs to the CES 2026 show in Las Vegas. Seen earlier at the FMS… In addition to the BG7 Series Client ...

Increased storage needs at the edge and in the cloud are fueling rising demand for higher-capacity flash memory across multiple applications. Released every 12 to 18 months, 3D NAND scaling outpaces ...

Forbes contributors publish independent expert analyses and insights. This is the second in a set of four blogs about projections for digital storage and memory for the following year that we have ...

Amid rising US-China tech tensions and tight semiconductor supply chains, YMTC disclosed advances in 3D NAND flash memory and plans to develop high bandwidth flash (HBF) technology. Their Xtacking ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically speeding up how data moves inside the chip. Unlike traditional flat designs, ...

Linus Tech Tips Video Provides Behind the Scenes Look at Kioxia’s Yokkaichi Fab Production of BiCS FLASH 3D Flash Memory and SSDs Kioxia America, Inc. today announced that Linus Tech Tips recently ...

Researchers at Stanford, MIT, and other universities unveiled a new, monolithic 3D processor that could help solve one of the biggest problems facing chipmakers: the processor-memory performance gap.

WASHINGTON, Dec 8 (Reuters) - China's top flash memory chipmaker Yangtze Memory Technologies Co (YMTC) has sued the U.S. Defense Department, challenging a decision to include the technology company on ...