From data collection to AI, digital tools are spreading across packaging and beyond. Adoption is uneven, but most companies are laying the groundwork for more connected, data-driven operations.

Charles R. Goulding and Andressa Bonafe trace Petrobras’ evolution from early 3D printing trials to certified components, ...

Influencer gifting evolves into a structured brand strategy, integrating product seeding and promotional gifting to ...

Courtesy of Tiffany & Co. There's a moment in product design when an object stops being a drawing and becomes a thing — when it acquires weight, ...

Kimberly-Clark’s Kotex transitions from plastic film polybags to recyclable cartons, introducing dual-panel opening, ...

Comprehensive data protection for sensitive 3D data with intelligent security features in KISTERS 3DViewStation SAN ...

Abstract: Various computational approaches predict chromatin structure, yielding concrete models that position genomic loci in physical space and help reveal genome organization and function. While ...

Fei-Fei Li’s World Labs has secured a $200 million investment from software design giant Autodesk as part of a larger $1 billion round from backers, including AMD, Emerson Collective, Fidelity, Nvidia ...

This recall involves Prismatic 3D Prints Book Nooks with Lights. The book nooks are bookshelf decorations meant to be placed in between books. The book nooks come in three designs: Fantasy Window, ...

AI compute is scaling at ~1.35× per year, nearly twice the pace of transistor scaling. Thus, the semiconductor industry has reached a hard inflection point: if we can’t scale down, we must scale up.

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...

Analyst Insight: When packaging engineers are brought in late in the process, a small issue can turn into major operational problems. A recent planter redesign showed how a quarter-inch mismatch ...