RAM Innovations, a R&D and manufacturing services provider and developer of embedded die packaging (EDP) solutions for electronics manufacturing, has been tasked with playing an essential role in a ...

PCBAIR's upgraded production line now supports precision heavy-copper fabrication of up to 10 oz (approx. 350µm) for both ...

PCB-based packaging for GaN power devices and modules is the subject of a UK government-funded consortium that will develop both technology and an all-UK GaN module supply-chain. The project, ...

A multi-domain passive module with functionality embedded in the substrate has been developed by Saras Micro Devices. The Saras Tile, or STILE, enables power regulation from system board to package.

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

Developing a power module requires enhanced design and verification methods. Currently, multiple iterations are needed to get the design done. Today, design and manufacturing processes are heavily ...

Semiconductor manufacturers have developed innovative production techniques that enable the integration of multiple components and a dc-dc converter IC die into a single module. Producing such a dc-dc ...

Power modules might be the semiconductor industry’s answer to some constant problems. With advanced component integration, optimization, and performance, modules deliver a power solution that ...

NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...