As computational demands for AI models surge, the hardware powering them faces a critical physical limitation: thermal ...

EDATEC has recently released the ED-IPC1000 and ED-IPC1100 Raspberry Pi CM0 -based industrial box PCs with DIN-rail mounting ...

After releasing the very powerful P895BD-AP AIoT module at CES 2026, Quectel now released two new low-power industrial AIoT ...

Highlighting advanced zero-crossing technology, reliability, and large-scale industrial manufacturing capabilities CALIFORNIA, CA, UNITED STATES, January 6, 2026 /EINPresswire.com/ — As global ...

Kyocera AVX has launched a new LDS cap antenna and evaluation board optimised for Iridium satellite IoT applications and designated as Iridium Qualified Antenna products for Iridium Certus 9704 ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

Abstract: Silicon carbide (SiC) power devices offer high switching speeds and power densities but are constrained by significant parasitic inductance and limited thermal dissipation capability.

Vishay Intertechnology Inc., a global manufacturer of passive and discrete solutions, kicked off the launch of its new MAACPAK power modules, catering to silicon carbide (SiC) MOSFETs. These offer ...

TL;DR: NVIDIA's unreleased TITAN Ada prototype GPU features a massive quad-slot design, 18,432 CUDA cores, and 48GB of GDDR6X memory, delivering extreme performance close to workstation levels. Its ...

SemiQ continues to expand its Gen3 QSiC MOSFET portfolio with 1200-V power modules offering high current density and low thermal resistance. The new seven-device lineup includes high-current S3 ...

DURHAM, N.C.--(BUSINESS WIRE)--Wolfspeed, Inc., a global leader in silicon carbide technology, today announced its new 1200V SiC six-pack power modules that redefine performance benchmarks for ...